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Campagne de collecte 15 septembre 2024 – 1 octobre 2024

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Livres
Articles (21)
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1

Solder joint and trace line failure simulation and experimental validation of fan-out type wafer level packaging subjected to drop impact

Chou, Chan-Yen, Hung, Tuan-Yu, Yang, Shin-Yueh, Yew, Ming-Chih, Yang, Wen-Kun, Chiang, Kuo-Ning

Journal:

Microelectronics Reliability

Année:

2008

Langue:

english

Fichier:

PDF, 1.34 MB

english, 2008

2

Fabrication process simulation and reliability improvement of high-brightness LEDs

Tsung-Lin Chou, Chien-Fu Huang, Cheng-Nan Han, Shin-Yueh Yang, Kuo-Ning Chiang

Journal:

Microelectronics Reliability

Année:

2009

Langue:

english

Fichier:

PDF, 920 KB

english, 2009

3

Measurement and simulation of interfacial adhesion strength between SiO2 thin film and III–V material

Tsung-Lin Chou, Shin-Yueh Yang, Chung-Jung Wu, Cheng-Nan Han, Kou-Ning Chiang

Journal:

Microelectronics Reliability

Année:

2011

Langue:

english

Fichier:

PDF, 1.17 MB

english, 2011

4

Light degradation test and design of thermal performance for high-power light-emitting diodes

Yen-Fu Su, Shin-Yueh Yang, Tuan-Yu Hung, Chang-Chun Lee, Kuo-Ning Chiang

Journal:

Microelectronics Reliability

Année:

2012

Langue:

english

Fichier:

PDF, 2.02 MB

english, 2012

5

Overview and applicability of residual stress estimation of film–substrate structure

Tsung-Lin Chou, Shin-Yueh Yang, Kuo-Ning Chiang

Journal:

Thin Solid Films

Année:

2011

Langue:

english

Fichier:

PDF, 1.79 MB

english, 2011

6

Analysis of Thermal and Luminous Performance of MR-16 LED Lighting Module

Wei-Hao Chi, Tsung-Lin Chou, Cheng-Nan Han, Shin-Yueh Yang, Kuo-Ning Chiang

Journal:

IEEE Transactions on Components and Packaging Technologies

Année:

2010

Langue:

english

Fichier:

PDF, 1.75 MB

english, 2010

7

Evaluation of Die Strength by Using Finite Element Method With Experiment Validation

Pei-Chi Chen,, Yen-Fu Su,, Shin-Yueh Yang,, Chang-Chun Lee,, Kuo-Ning Chiang,

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Année:

2014

Langue:

english

Fichier:

PDF, 2.05 MB

english, 2014

8

[IEEE Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2008.10.22-2008.10.24)] 2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference - Investigation of Influences of PCB on Board-level Drop Test by Dynamic Simulation and Modal Analysis

Chou, Chan-Yen, Hung, Tuan-Yu, Sano, Masafumi, Yang, Shin-Yueh, Chiang, Kuo-Ning

Année:

2008

Langue:

english

Fichier:

PDF, 4.08 MB

english, 2008

9

Determination of Initial Crack Strength of Silicon Die Using Acoustic Emission Technique

Chen, Pei-Chi, Su, Yen-Fu, Yang, Shin-Yueh, Liang, Steven Y., Chiang, Kuo-Ning

Journal:

Journal of Electronic Materials

Année:

2015

Langue:

english

Fichier:

PDF, 5.82 MB

english, 2015

10

Bi-dimensional finite element analysis for modal separation of a circular cylindrical WW-USM

Tai-Ho Yu, Shin-Yueh Yang, Chen-Liang Lee, Ching-Chung Yin

Journal:

Finite Elements in Analysis and Design

Année:

2011

Langue:

english

Fichier:

PDF, 1.04 MB

english, 2011

11

[IEEE 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2011.10.19-2011.10.21)] 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Determination of silicon die initial crack using acoustic emission technique

Chen, Pei-Chi, Su, Yen-Fu, Yang, Shin-Yueh, Chiang, Kuo-Ning

Année:

2011

Langue:

english

Fichier:

PDF, 699 KB

english, 2011

12

[IEEE Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Bordeaux, France (2010.04.26-2010.04.28)] 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) - Light degradation prediction of high-power light-emitting diode lighting modules

Yen-Fu Su,, Shin-Yueh Yang,, Chi, Wei-Hao, Chiang, Kuo-Ning

Année:

2010

Langue:

english

Fichier:

PDF, 8.62 MB

english, 2010

13

[IEEE 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2009.10.21-2009.10.23)] 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference - Reliability analysis of copper interconnections of system-in-packaging

Shin-Yueh Yang,, Shih-Ying Chiang,, Chan-Yen Chou,, Ming-Chih Yew,, Kuo-Ning Chiang,

Année:

2009

Langue:

english

Fichier:

PDF, 1.72 MB

english, 2009

14

[IEEE 2010 3rd Electronic System-Integration Technology Conference (ESTC) - Berlin, Germany (2010.09.13-2010.09.16)] 3rd Electronics System Integration Technology Conference ESTC - Determination of maximum strength and optimization of LED chip structure

Yang, Shin-Yueh, Chou, Tsung-Lin, Huang, Chien-Fu, Chung-Jung Wu,, Chia-Liang Hsu,, Chiang, Kuo-Ning

Année:

2010

Langue:

english

Fichier:

PDF, 1.77 MB

english, 2010

15

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2008.07.28-2008.07.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - Reliability Analysis of copper interconnections of system-in-packaging structure using finite element method

Shih-Ying Chiang,, Shin-Yueh Yang,, Chan-Yen Chou,, Ming-Chih Yew,, Kuo-Ning Chiang,

Année:

2008

Langue:

english

Fichier:

PDF, 1.02 MB

english, 2008

16

[IEEE 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2012.05.30-2012.06.1)] 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Quantum efficiency investigation at high current density of Ultra-High-Brightness LEDs

Chien-Fu Huang,, Yen-Fu Su,, Shin-Yueh Yang,, Chia-Liang Hsu,, Nai-Chuan Chen,, Kuo-Ning Chiang,

Année:

2012

Langue:

english

Fichier:

PDF, 1.16 MB

english, 2012

17

[IEEE 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2010.10.20-2010.10.22)] 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference - Strength determination of light-emitting diodes and chip structure design

Yang, Shin-Yueh, Chou, Tsung-Lin, Huang, Chien-Fu, Wu, Chung-Jung, Hsu, Chia-Liang, Chiang, Kuo-Ning

Année:

2010

Langue:

english

Fichier:

PDF, 1.03 MB

english, 2010

18

[IEEE 2009 10th International Conferene on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Delft, The Netherlands (2009.04.26-2009.04.29)] EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Uncertainty and reliability analysis of chip scale package subjected to Board-level Drop test

Masafumi Sano,, Chou, Chan-Yen, Hung, Tuan-Yu, Shin-Yueh Yang,, Kuo-Ning Chiang,

Année:

2009

Langue:

english

Fichier:

PDF, 1.08 MB

english, 2009

19

[IEEE 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2009.10.21-2009.10.23)] 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference - Reliability and parametric study on chip scale package under board-level drop test

Masafumi Sano,, Chou, Chan-Yen, Hung, Tuan-Yu, Yang, Shin-Yueh, Chao-Jen Huang,, Chiang, Kuo-Ning

Année:

2009

Langue:

english

Fichier:

PDF, 1.39 MB

english, 2009

20

[IEEE 2010 IEEE CPMT Symposium Japan (Formerly VLSI Packaging Workshop of Japan) - Tokyo, Japan (2010.08.24-2010.08.26)] 2010 IEEE CPMT Symposium Japan - A study on the thermal performance of a chip-in-substrate-type LED package structure

Su, Yen-Fu, Hung, Tuan-Yu, Yang, Shin-Yueh, Chiang, Kuo-Ning

Année:

2010

Langue:

english

Fichier:

PDF, 723 KB

english, 2010

21

[ASME ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems - Portland, Oregon, USA (July 6–8, 2011)] ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1 - Determination and Verification of Silicon Die Strength Using Ball-Breaker Test

Chen, Pei-Chi, Yang, Shin-Yueh, Chiang, Kuo-Ning

Année:

2011

Langue:

english

Fichier:

PDF, 696 KB

english, 2011